View STPS2L40UF_4631304.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

STPS2L40
Low drop power Schottky rectifier
Main product characteristics
A
IF(AV) VRRM Tj (max) VF(max)
2A 40 V 150 C 0.34 V
K
SMB STPS2L40U
Features and Benefits

Very small conduction losses Negligible switching losses Low forward voltage drop Surface mount miniature package Avalanche capability specified
K
A
SMB flat STPS2L40UF
Description
Single chip Schottky rectifiers suited to Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in SMB, and low profile SMB, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. Table 1.
Symbol VRRM IF(AV) IFSM PARM Tstg Tj
1.
dPtot --------------dTj
Order codes
Part number STPS2L40U STPS2L40UF marking GD4 FGD4
Absolute Ratings (limiting values)
Parameter Repetitive peak reverse voltage Average forward current SMB SMB flat TL = 130 C = 0.5 TL = 140 C = 0.5 tp = 10 ms sinusoidal tp = 1 s Tj = 25 C Value 40 2 75 2200 -65 to + 150
(1)
Unit V A A W C C
Surge non repetitive forward current Repetitive peak avalanche power Storage temperature range Operating junction temperature
1 ------------------------Rth ( j - a )
150
<
condition to avoid thermal runaway for a diode on its own heatsink
February 2007
Rev 3
1/8
www.st.com 8
Characteristics
STPS2L40
1
Characteristics
Table 2.
Symbol
Thermal resistances
Parameter SMB Junction to lead SMB flat 10 Value 20 C/W Unit
Rth (j-l) Table 3.
Symb ol
Static electrical characteristics
Tests Conditions Tests Conditions Tj = 25 C Min. Typ. Max. 220 Unit A mA mA
IR
(1)
Reverse leakage current
Tj = 100 C Tj = 125 C Tj = 25 C Tj = 125 C
VR = 40 V
38
20 80 0.39 0.25 0.28
IF = 1 A IF = 2 A IF = 4 A
V 0.43 0.31 0.34 0.5 V 0.39 0.45
VF(1)
Forward voltage drop
Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C
1. Pulse test: tp = 380 s, < 2
To evaluate the conduction losses use the following equation: P = 0.22 x IF(AV) + 0.06 IF2(RMS) Figure 1.
PF(AV)(W)
1.2 2.2
Average forward power dissipation Figure 2. versus average forward current
IF(AV)(A)
= 0.1 = 0.2 = 0.5
Average forward current versus ambient temperature ( = 0.5) SMB
Rth(j-a)=Rth(j-l) SMB
2.0 1.8
Rth(j-a)=100C/W
1.0
= 0.05
1.6 0.8
=1
1.4 1.2
0.6 1.0 0.4 0.8 0.6
T
0.2 0.4
T
IF(AV)(A)
0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
=tp/T
2.2 2.4
0.2
tp
0.0 2.6 2.8 0
=tp/T
25
tp
50
Tamb(C)
75 100 125 150
2/8
STPS2L40
Characteristics
Figure 3.
Average forward current versus ambient temperature ( = 0.5) SMB flat
Rth(j-a)=Rth(j-l)
Figure 4.
Non repetitive surge peak forward current versus overload duration (maximum values) SMB
SMB
IF(AV)(A)
2.2 2.0 1.8
Rth(j-a)=100C/W SMB flat
IM(A)
12 11 10 9 8 7 6
Ta=25C
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0
Ta=75C
5 4
T
3 2
IM t
Ta=125C
=tp/T
25
tp
50
Tamb(C)
75 100 125 150
1 0 1.E-03
=0.5
t(s)
1.E-02 1.E-01 1.E+00
Figure 5.
Non repetitive surge peak forward current versus overload duration (maximum values) SMB flat
SMB flat (non exposed pad)
Figure 6.
Normalized avalanche power derating versus pulse duration
IM(A)
30
PARM(tp) PARM(1s)
1
25
20
0.1
15
TL=25C TL=75C
10
TL=125C
0.01
IM t
5
=0.5
t(s)
1.E-02 1.E-01 1.E+00
0.001 0.01 0.1 1
tp(s)
10 100 1000
0 1.E-03
Figure 7.
Normalized avalanche power derating versus junction temperature
Figure 8.
Relative variation of thermal impedance junction to ambient versus pulse duration - SMB
PARM(tp) PARM(25C)
1.2 1
Zth(j-a)/Rth(j-a)
1.0 0.9 0.8 0.7
SMB
0.8 0.6 0.4 0.2
0.6 0.5 0.4 0.3 0.2
T
Single pulse
Tj(C)
0 25 50 75 100 125 150
0.1 0.0 1.E-02 1.E-01 1.E+00
tp(s)
1.E+01
=tp/T
1.E+02
tp
1.E+03
3/8
Characteristics
STPS2L40
Figure 9.
Relative variation of thermal impedance junction to lead versus pulse duration - SMB flat
Figure 10. Reverse leakage current versus reverse voltage applied (typical values)
IR(mA)
1.E+02
Tj=125C
Zth(j-l)/Rth(j-l)
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2
Single pulse
SMB flat
1.E+01
1.E+00
1.E-01
Tj=25C
T
1.E-02
tp
0.1 0.0 1.E-04 1.E-03 1.E-02
tp(s)
1.E-01
=tp/T
1.E+00
VR(V)
1.E-03 0 5 10 15 20 25 30 35 40
1.E+01
Figure 11. Junction capacitance versus reverse voltage applied (typical values)
C(pF)
1000
F=1MHz VOSC=30mVRMS Tj=25C
Figure 12. Forward voltage drop versus forward current (high level)
IFM(A)
10.0
Tj=125C (typical values)
Tj=125C (maxmimum values)
Tj=25C (maximum values)
100
1.0
VR(V)
10 1 10 100 0.1 0.0 0.1 0.2 0.3
VFM(V)
0.4 0.5 0.6 0.7
Figure 13. Forward voltage drop versus forward current (low level)
Figure 14. Thermal resistance junction to ambient versus copper surface under each lead (epoxy printed board FR4, eCU=35m)
Rth(j-a)(C/W)
110 100
IFM(A)
3.0
2.5
Tj=125C (typical values)
90 80
SMB
2.0
Tj=25C (maximum values)
70 60 50 40 30
SMB flat
1.5
Tj=125C (maxmimum values)
1.0
0.5
20
VFM(V)
0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6
10 0 0.0 0.5 1.0 1.5 2.0
SCU(cm)
2.5 3.0 3.5 4.0 4.5 5.0
4/8
STPS2L40
Package Information
2
Package Information
Epoxy meets UL94,V0 SMB dimensions
Dimensions Ref.
E1
Table 4.
Millimeters Min. Max. 2.45 0.20 2.20 0.40 5.60 4.60 3.95 1.50
Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.059
D
A1 A2 b
1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75
E
c
A1
E E1
b
C L
A2
D L
Figure 15. SMB footprint (dimensions in mm)
1.62 2.60 1.62
2.18
5.84
5/8
Package Information Table 5. SMB Flat dimensions
Dimensions Ref.
A c D L L2 E E1 L L1 b
STPS2L40
Millimeters Min. Typ. Max. Min. 0.035 0.077 0.006 0.130 0.200 0.189 0.029
Inches Typ. Max. 0.043 0.087 0.016 0.156 0.220 0.181 0.059 0.016 0.024
A b(1) c
(1)
0.90 1.95 0.15 3.30 5.10 4.05 0.75 0.40 0.60
1.10 2.20 0.40 3.95 5.60 4.60 1.50
D E E1 L L1 L2
1. Applies to plated leads
Figure 16. SMB Flat footprint (dimensions in mm)
5.84
2.07
1.20
3.44
1.20
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
6/8
STPS2L40
Ordering Information
3
Ordering Information
Ordering type STPS2L40U STPS2L40UF Marking GD4 FGD4 Package SMB SMB flat Weight 0.107 g 0.50 g Base qty 2500 5000 Delivery mode Tape and reel Tape and reel
4
Revision history
Date Jul-2003 31-Jan-2007 Revision 2A 3 Last update. Reformatted to current standard. Added ECOPACK statement. Added SMB flat package. Description of Changes
7/8
STPS2L40
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
(c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
8/8

▲Up To Search▲

Price & Availability of STPS2L40UF

	To Download STPS2L40UF Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .